PLATING RESIST MR-303Fī

PLATING RESIST MR-303FʺڲֶƽõڱεĵҺ, ԰Ϳī.ҲʺITOõʴī.

 
PLATING RESIST MR-303F is one component, alkaline removable type Resist Ink developed for masking of partial Au plating.
Moreover, it is possible to be used as etching ink for ITO.

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1. Cured film has flexibility, and available for a flexible board and a rigid board.
2. This ink has excellent resistance to Au plating( Electro-less),since the contamination to the plating solution
is very small, control of the solution is easy.
3. Possible to be used as etching ink for ITO.

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Color Black color Visual
Viscosity at 25 deg.C 200 dPa・ Viscotester VT-04
Applicable Screen 150250 Mesh Polyester Screen
Optimum Ink thickness after drying 1020µ Thickness Meter
Dry Conditions 100deg.C × 10min Circulating Heat Oven
Adhesion 100 100 Cross-cut,ape peel test
Resistance to Electro-less Plating No penetration, No color change Ni Plating at 90deg.C for 30 min + Au Plating at 90deg.C for 40 min
Remove of the cured film 13 wt% NaOH Solution 30deg.C × 13 min Dipping

The above information obtained by actual measurement at our lab., and do not specified values.
< Shelf-life > Main body: 6 months --- Stored in 25 deg.C or below (cool and dark place).
Usage and handling precautions
1. If dilution is needed due to viscosity variation during operation, dilute with exclusive reducer #70 within 5%.
2. Drying should be done at the range of 100deg.C130deg.C. Since drying time will vary based on s heat efficiency and ventilation capacity of used oven, please confirm your oven and set optimum condition.
3. This resist can be used for general Ni/Au plating solution without any inconvenience.

However, if it is used for special plating solution, it may cause the change in characteristics, depending on its composition. Please use it after checking fully.

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Mandrel diameter 8mmφ 6mmφ 4mmφ 3mmφ 2mmφ
Conventional products No Crack Crack Crack Crack Crack
MR-303F No Crack No Crack No Crack No Crack No Crack

Test board Thickness 25µm/PI film
Screen mesh 200mesh polyester screen
Dry condition 100deg.C × 10min Circulating Heat Oven
Ink thickness after drying Thickness 1416µm

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 ・Absorbance is high=Quantity of elution is large ・Absorbance is low=Quantity of elution is small Compared to Ni Plating new solution, absorbance peak which arise from elusion content from coated film can be confirmed at around 280nm for conventional product though, the peak can not be confirmed in MR-303F.

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Test Board 5.6cm×4cm /PI film/4 pieces
Dry condition 100deg.C × 10min Circulating Heat Oven
Ink thickness after drying About 30µm
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Plating solution Product made by OKUNO CHEMICAL INDUSTRIES CO.,LTD
Dip condition 80 deg.C × 4hr
G Gƽ̨ Gע Gֵ¼ Testing equipment Product made in SHIMADZU CORPORATION UV-1800
Kind of measurements Absorbance
Measurement wavelength(nm) 200900

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Test Board ITO/PET film
Screen mesh 200mesh polyester screen
Dry condition 100deg.C × 10min Circulating Heat Oven
Ink thickness after drying Thickness 1015µm

G Gƽ̨ Gע Gֵ¼ Etching solution Mixed acid ITO-02 Product made by KANTO CHEMICAL CO.,INC.
Dip condition 45deg.C × 4min
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Remove solution 3NaOH
Dip condition 30 deg.C × 1min
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Measuring instrument Product made by YOKOGAWA ELECTRIC CORPORATION DEGITAL MLTIMETER 755S

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Test Board PI film・ Glass epoxy copper foil
Screen mesh 200mesh polyester screen
Dry condition 100deg.C × 10min Circulating Heat Oven
Ink thickness after drying Thickness 1015µm
Additional heating condition 180×1-5hr/ Heat circulation oven
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Remove solution 3NaOH
Dip condition 30 deg.C × 1min
Check strippability Visual

 

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